Detailed explanation of COB light source packaging process

custom COB LED

Detailed explanation of COB light source packaging process

1. Substrate preparation: Select a suitable substrate as the bottom support for the COB light source, apply thermal conductive adhesive or thermal conductive bonding agent on the substrate for fixing and heat dissipation.
2. Paste LED chips: Paste multiple LED chips onto the substrate according to the design requirements. Automated equipment is usually used for precise positioning and pasting of LED chips.
3. Circuit connection: Use materials such as gold/copper wires or conductive adhesive to connect the LED chip to the leads or circuits on the substrate. These connections usually require welding or bonding.
4. Thermal conductivity treatment: Fill the gap between the LED chip and the substrate with thermal conductive materials such as thermal conductive adhesive and thermal conductive bonding agent to improve the heat dissipation effect. Thermal conductivity treatment can be completed manually or through automated equipment.

How to customize COB LED products?>>

5. Encapsulation curing: Place the COB light source in a specific curing device and use methods such as ultraviolet irradiation or thermal curing to cure the thermal conductive adhesive or adhesive, ensuring a stable connection between the LED chip and the substrate.
6. Lighting test: Conduct lighting tests on COB light sources, including testing of brightness, color temperature, color uniformity, and other performance indicators. This can be done through equipment with optical testing capabilities.
7. Sorting and packaging: After completing the lighting test, the COB light source is sorted and packaged, usually using packaging glue, plastic boxes, or tape for protection.

Go To See Our Various Custom COB LED Products Video>>

It should be noted that the specific steps and materials in the COB light source packaging process may vary depending on different manufacturers and applications. The requirements for precision, process control, and quality inspection during the packaging process may also vary. These steps are aimed at ensuring that the stability, heat dissipation, and optoelectronic performance of COB light sources meet the expected requirements.

Leave a Reply

Your email address will not be published. Required fields are marked *